All Stories

  1. Power-Law Time Exponent n and Time-to-Failure in 4H-SiC MOSFETs: Beyond Fixed Reaction–Diffusion Theory

    Article • Micromachines, November 2025, MDPI AG

    Professor Joseph Bernstein

  2. Switching Frequency Figure of Merit for GaN FETs in Converter-on-Chip Power Conversion

    Article • Electronics, September 2025, MDPI AG

    Professor Joseph Bernstein

  3. Power-Law Reliability Plotting for Microelectronics

    Article • Micromachines, September 2025, MDPI AG

    Professor Joseph Bernstein

  4. Reliability Challenges, Models, and Physics of Silicon Carbide and Gallium Nitride Power Devices

    Article • Energies, February 2025, MDPI AG

    Professor Joseph Bernstein

  5. Gate Driver for High-Frequency Power Converter

    Article • Electronics, January 2025, MDPI AG

    Professor Joseph Bernstein

  6. Modern Trends in Microelectronics Packaging Reliability Testing

    Article • Micromachines, March 2024, MDPI AG

    Professor Joseph Bernstein

  7. Mitigation of Thermal Stability Concerns in FinFET Devices

    Article • Electronics, October 2022, MDPI AG

    Professor Joseph Bernstein

  8. Self-heating Effects Measured in Fully Packaged FinFET Devices

    Article • September 2021, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  9. GaN based Ring Oscillator PWM Generator

    Article • May 2021, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  10. Microchip Health Monitoring System Using the FLL Circuit

    Article • Sensors, March 2021, MDPI AG

    Professor Joseph Bernstein

  11. Reliability prediction of FinFET FPGAs by MTOL

    Article • Microelectronics Reliability, November 2020, Elsevier

    Professor Joseph Bernstein

  12. Design Considerations for GaN Based Converters

    Article • November 2019, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  13. On the Ballistic Transport in Si Nano-Devices

    Article • September 2019, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  14. A Novel Reliability Model For GaN Power FET

    Article • December 2018, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  15. Synopsis of Multiphysics Deep Sub-Micron Failure Rate Modeling Technique for CFR and EOL Prediction

    Article • October 2018, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  16. An improved reliability model for Si and GaN power FET

    Article • Microelectronics Reliability, February 2018, Elsevier

    Professor Joseph Bernstein

  17. Reliability prediction with MTOL

    Article • Microelectronics Reliability, January 2017, Elsevier

    Professor Joseph Bernstein

  18. Aerospace electronics reliability: Could it be predicted in a cost-effective fashion?

    Article • March 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  19. Reliability matrix solution to multiple mechanism prediction

    Article • Microelectronics Reliability, December 2014, Elsevier

    Professor Joseph Bernstein

  20. Estimation of lifetimes of components that operate under ageing-attributable wearing conditions

    Article • September 2014, Taylor & Francis

    Professor Joseph Bernstein

  21. M-HTOL Principles

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  22. Failure Mechanisms

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  23. Introduction

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  24. New M-HTOL Approach

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  25. Shortcut to Accurate Reliability Prediction

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  26. Reliability Prediction from Burn-In Data Fit to Reliability Models

    Article • January 2014, Elsevier

    Professor Joseph Bernstein

  27. Nondestructive Quantitative Analysis of Crack Propagation in Solder Joints

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, August 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  28. Design optimization of laser-induced microbridges for low resistance interline connections in ICs

    Article • Microelectronic Engineering, March 2013, Elsevier

    Professor Joseph Bernstein

  29. Celebrating fifty years of physics of failure

    Article • January 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  30. Integrated circuit reliability prediction based on physics-of-failure models in conjunction with field study

    Article • January 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  31. Structural health monitoring of solder joints in QFN package

    Article • Microelectronics Reliability, December 2012, Elsevier

    Professor Joseph Bernstein

  32. Prediction of earpiece field failure rate based on accelerated life tests

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  33. Solder-Joint Quantitative Crack Analysis—Ohmic Resistance Approach

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  34. Reliability evaluation and modeling of high density electronic packages

    Article • Microelectronics International, January 2012, Emerald

    Professor Joseph Bernstein

  35. Hardware Error Likelihood Induced by the Operation of Software

    Article • IEEE Transactions on Reliability, September 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  36. Quantitatively analyzing the performance of integrated circuits and their reliability

    Article • IEEE Instrumentation and Measurement Magazine, February 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  37. Design‐for‐reliability implementation in microelectronics packaging development

    Article • Microelectronics International, January 2011, Emerald

    Professor Joseph Bernstein

  38. FaRBS: A new PoF based VLSI reliability prediction method

    Article • January 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  39. A study of scaling effects on DRAM reliability

    Article • January 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  40. Experimental investigation of the optimal laser-induced microbridges

    Article • Precision Engineering, July 2010, Elsevier

    Professor Joseph Bernstein

  41. Assessment of acceleration models used for BGA solder joint reliability studies

    Article • Microelectronics Reliability, December 2009, Elsevier

    Professor Joseph Bernstein

  42. Failure rate estimation of known failure mechanisms of electronic packages

    Article • Microelectronics Reliability, December 2009, Elsevier

    Professor Joseph Bernstein

  43. Local Oscillations of On-Die Supply Voltage—A Reliability Issue

    Article • IEEE Transactions on Device and Materials Reliability, September 2009, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  44. Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications

    Article • IEEE Transactions on Device and Materials Reliability, September 2009, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  45. Time-Dependent Dielectric Breakdown of 4H-SiC/$ \hbox{SiO}_{2}$ MOS Capacitors

    Article • IEEE Transactions on Device and Materials Reliability, December 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  46. Reliability Simulation and Design Consideration of High Speed ADC Circuits

    Article • October 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  47. Study of Transistor and Product NBTI Lifetime Distributions

    Article • October 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  48. Study of Transistor and Product NBTI Lifetime Distributions

    Article • October 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  49. Reliability Study of High-Density EBGA Packages Using the Cu Metallized Silicon

    Article • IEEE Transactions on Components and Packaging Technologies, September 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  50. Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast $I$–$V$ Techniques

    Article • IEEE Transactions on Electron Devices, August 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  51. Supply signal fluctuations due to chip power grid resonance — a new reliability concern

    Article • April 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  52. Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation

    Article • IEEE Transactions on Device and Materials Reliability, March 2008, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  53. SRAM stability analysis considering gate oxide SBD, NBTI and HCI

    Article • October 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  54. Characterization of interface and bulk oxide traps in SiC MOSFETs with epitaxialy grown and implanted channels

    Article • October 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  55. Spatial Distributions of Trapping Centers in $ \hbox{HfO}_{2}/\hbox{SiO}_{2}$ Gate Stack

    Article • IEEE Transactions on Electron Devices, June 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  56. Ultra-Fast Characterization of Transient Gate Oxide Trapping in SiC Mosfets

    Article • April 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  57. Electronic circuit reliability modeling

    Article • Microelectronics Reliability, December 2006, Elsevier

    Professor Joseph Bernstein

  58. Enhanced Gate Induced Drain Leakage Current in HfO2 MOSFETs due to Remote Interface Trap-Assisted Tunneling

    Article • December 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  59. Non-Arrhenius Temperature Acceleration and Stress-Dependent Voltage Acceleration for Semiconductor Device Involving Multiple Failure Mechanisms

    Article • October 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  60. Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

    Article • October 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  61. Ultra-Fast Measurements of VTH Instability in SiC MOSFETs due to Positive and Negative Constant Bias Stress

    Article • October 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  62. Software Reliability Estimation of Microprocessor Transient Faults

    Article • July 2006, American Institute of Aeronautics and Astronautics (AIAA)

    Professor Joseph Bernstein

  63. A New SPICE Reliability Simulation Method for Deep Submicrometer CMOS VLSI Circuits

    Article • IEEE Transactions on Device and Materials Reliability, June 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  64. SRAM Circuit-Failure Modeling and Reliability Simulation With SPICE

    Article • IEEE Transactions on Device and Materials Reliability, June 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  65. Spatial distributions of trapping centers in HfO2∕SiO2 gate stacks

    Article • Applied Physics Letters, April 2006, American Institute of Physics

    Professor Joseph Bernstein

  66. Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides

    Article • Microelectronics Reliability, March 2005, Elsevier

    Professor Joseph Bernstein

  67. Liquid dispensing encapsulation in semiconductor packaging

    Article • Microelectronics International, December 2003, Emerald

    Professor Joseph Bernstein

  68. Impact of substrate hot hole injection on ultrathin silicon dioxide breakdown

    Article • Applied Physics Letters, May 2003, American Institute of Physics

    Professor Joseph Bernstein

  69. Analysis of energy process window of laser metal pad cut link structure

    Article • IEEE Transactions on Semiconductor Manufacturing, May 2003, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  70. Impact of junction temperature on microelectronic device reliability and considerations for space applications

    Article • January 2003, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  71. Impact of the trapping of anode hot holes on silicon dioxide breakdown

    Article • IEEE Electron Device Letters, November 2002, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  72. Encapsulation process development for flexible-circuit based chip scale packages

    Article • IEEE Transactions on Electronics Packaging Manufacturing, October 2002, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  73. Physics-based numerical modeling and characterization of 6H-silicon-carbide metal–oxide–semiconductor field-effect transistors

    Article • Journal of Applied Physics, September 2002, American Institute of Physics

    Professor Joseph Bernstein

  74. Interaction between low-energy electrons and defects created by hot holes in ultrathin silicon dioxide

    Article • Applied Physics Letters, April 2002, American Institute of Physics

    Professor Joseph Bernstein

  75. Effect of the plasma cleaning process on plastic ball grid array package assembly reliability

    Article • IEEE Transactions on Electronics Packaging Manufacturing, April 2002, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  76. Observation of latent reliability degradation in ultrathin oxides after heavy-ion irradiation

    Article • Applied Physics Letters, February 2002, American Institute of Physics

    Professor Joseph Bernstein

  77. Heavy-ion-induced soft breakdown of thin gate oxides

    Article • IEEE Transactions on Nuclear Science, December 2001, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  78. The impact of lead‐free soldering on electronics packages

    Article • Microelectronics International, December 2001, Emerald

    Professor Joseph Bernstein

  79. Energy effect of the laser-induced vertical metallic link

    Article • IEEE Transactions on Semiconductor Manufacturing, May 2001, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  80. Time-dependent breakdown of ultra-thin SiO2 gate dielectrics under pulsed biased stress

    Article • IEEE Electron Device Letters, May 2001, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  81. Reliability of ultrathin silicon dioxide under combined substrate hot-electron and constant voltage tunneling stress

    Article • IEEE Transactions on Electron Devices, June 2000, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  82. Analysis of laser metal-cut energy process window

    Article • IEEE Transactions on Semiconductor Manufacturing, May 2000, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  83. Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions

    Article • IEEE Transactions on Industry Applications, January 2000, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  84. Scalability study of laser-induced vertical make-link structure

    Article • IEEE Transactions on Semiconductor Manufacturing, January 2000, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  85. Reliability of laser-induced metallic vertical links

    Article • IEEE Transactions on Advanced Packaging, January 1999, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  86. A new technique for determining long-term TDDB acceleration parameters of thin gate oxides

    Article • IEEE Electron Device Letters, July 1998, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  87. Laser formed metallic connections

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology Part B, May 1998, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  88. Laser energy limitation for buried metal cuts

    Article • IEEE Electron Device Letters, January 1998, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  89. Laser linking of metal interconnects: analysis and design considerations

    Article • IEEE Transactions on Electron Devices, March 1996, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  90. Laser linking of metal interconnect: linking dynamics and failure analysis

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology Part A, January 1996, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  91. Laser-formed metallic connections employing a lateral link structure

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology Part A, January 1995, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  92. High-density laser linking of metal interconnect

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology Part A, January 1994, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  93. Short-time failure of metal interconnect caused by current pulses

    Article • IEEE Electron Device Letters, October 1993, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  94. Metal wire cutting by repeated application of low-power laser pulses

    Article • Review of Scientific Instruments, June 1992, American Institute of Physics

    Professor Joseph Bernstein

  95. The effect of multiple laser pulses on damage to thin metallic films

    Article • Journal of Applied Physics, January 1992, American Institute of Physics

    Professor Joseph Bernstein

  96. Improvements to the Electrically Stimulated Acoustic Wave method for analyzing bulk space charge

    Article • IEEE Transactions on Electrical Insulation, January 1992, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  97. Laser-induced line melting and cutting

    Article • IEEE Transactions on Electron Devices, January 1992, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  98. Analysis of the electrically stimulated acoustic-wave method for observing space charge in semi-insulating films

    Article • November 1991, American Physical Society (APS)

    Professor Joseph Bernstein

  99. The Mechanism of Laser‐Induced Vertical Links

    Article • Journal of The Electrochemical Society, October 1991, The Electrochemical Society

    Professor Joseph Bernstein

  100. Bulk space charge behavior in polymethylethacrylate under an imposed virtual cathode condition

    Article • IEEE Transactions on Electrical Insulation, January 1991, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  101. Electric poling behavior of polymethylmethacrylate

    Article • IEEE Transactions on Electrical Insulation, January 1991, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  102. Laser-induced melting of thin conducting films. II. Heat-dissipating substrates

    Article • IEEE Transactions on Electron Devices, January 1991, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  103. The Deal fast-surface states are probably deep-level impurities in the semiconductor

    Article • IEEE Circuits and Devices Magazine, November 1985, Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  104. Deep Submicron CMOS Integrated Circuit Reliability Simulation with SPICE

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  105. Impact of Device Scaling on Deep Sub-Micron Transistor Reliability - A Study of Reliability Trends Using SRAM

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  106. Simulating and Improving Microelectronic Device Reliability by Scaling Voltage and Temperature

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  107. Study of the Impact of Hardware Fault on Software Reliability

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  108. A high performance radiation-hard field programmable analog array

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  109. Acceleration factors and mechanistic study of progressive breakdown in small area ultra-thin gate oxides

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  110. Combined channel segmentation and buffer insertion for routability and performance improvement of field programmable analog arrays

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  111. Mechanism for reduced NBTI effect under pulsed bias stress conditions

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  112. A reliability evaluation methodology for memory chips for space applications when sample size is small

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  113. Reliable laser programmable gate array technology

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  114. Temperature dependence of R/sub on,sp/ in silicon carbide and GaAs Schottky diode

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  115. Electromigration simulation under DC/AC stresses considering microstructure

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein

  116. Laser programmable metallic vias

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Professor Joseph Bernstein