Design‐for‐reliability implementation in microelectronics packaging development

Liyu Yang, Rui Niu, Jinsong Xie, Bin Qian, Baishi Song, Qingan Rong, Joseph Bernstein
  • Microelectronics International, January 2011, Emerald
  • DOI: 10.1108/13565361111097092

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http://dx.doi.org/10.1108/13565361111097092

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