Assessment of acceleration models used for BGA solder joint reliability studies

Liyu Yang, Joseph B. Bernstein, T. Koschmieder
  • Microelectronics Reliability, December 2009, Elsevier
  • DOI: 10.1016/j.microrel.2009.07.054

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http://dx.doi.org/10.1016/j.microrel.2009.07.054

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