Structural health monitoring of solder joints in QFN package

I. Gershman, J.B. Bernstein
  • Microelectronics Reliability, December 2012, Elsevier
  • DOI: 10.1016/j.microrel.2012.07.001

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http://dx.doi.org/10.1016/j.microrel.2012.07.001

The following have contributed to this page: Joseph Bernstein