Integrated circuit reliability prediction based on physics-of-failure models in conjunction with field study

A. Hava, J. B. Bernstein, Y. Bot, Jin Qin
  • January 2013, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/rams.2013.6517737

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http://dx.doi.org/10.1109/rams.2013.6517737

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