All Stories

  1. Realistic warpage evaluation of printed board assembly during reflow process

    Article • Soldering & Surface Mount Technology, September 2015, Emerald

    Dr Jae B Kwak

  2. Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

    Article • Soldering & Surface Mount Technology, February 2015, Emerald

    Dr Jae B Kwak

  3. Integrated hygro-swelling and thermo-mechanical behavior of mold compound for MEMS package during reflow after moisture preconditioning

    Article • Microelectronics International, January 2015, Emerald

    Dr Jae B Kwak

  4. Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

    Article • Journal of Mechanical Science and Technology, December 2014, Springer Science + Business Media

    Dr Jae B Kwak

  5. Development of PCB design guide and PCB deformation simulation tool for slim PCB quality and reliability

    Article • May 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jae B Kwak

  6. The effects of underfill on the thermal fatigue reliability of solder joints in newly developed flip chip on module

    Article • May 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jae B Kwak

  7. Effect of Shield-Can on Dynamic Response of Board-Level Assembly

    Article • Journal of Electronic Packaging, January 2012, ASME International

    Dr Jae B Kwak

  8. Experimental Assessment of Electronic Package Deformation Using Digital Image Correlation Technique

    Article • Journal of The Japan Institute of Electronics Packaging, January 2011, Japan Institute of Electronics Packaging

    Dr Jae B Kwak

  9. Dynamic responses of PCB under product-level free drop impact

    Article • Microelectronics Reliability, July 2010, Elsevier

    Dr Jae B Kwak

  10. Effect of glue on reliability of flip chip BGA packages under thermal cycling

    Article • Microelectronics Reliability, July 2010, Elsevier

    Dr Jae B Kwak

  11. Effect of shield-can for drop/shock behavior of board level assembly

    Article • June 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jae B Kwak

  12. Conjugate Effect of Hygro and Thermo-Mechanical Behavior in MEMS Packages

    Article • January 2010, ASME International

    Dr Jae B Kwak

  13. Effect of damping and air cushion on dynamic responses of PCB under product level free drop impact

    Article • May 2009, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jae B Kwak

  14. Effect of Shield-Can Design on Dynamic Responses of PCB Under Board Level Drop Impact

    Article • January 2009, ASME International

    Dr Jae B Kwak

  15. Deformation and Strain Measurement of Flip-Chip Solder Bump Under In-Situ Thermal Loading

    Article • January 2009, ASME International

    Dr Jae B Kwak

  16. Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

    Article • January 2009, ASME International

    Dr Jae B Kwak

  17. Effect of Boundary Conditions on the Dynamic Response Characterization Of Board-Level Drop Test

    Article • December 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Jae B Kwak