Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
  • Journal of Electronic Packaging, January 2012, ASME International
  • DOI: 10.1115/1.4007118

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http://dx.doi.org/10.1115/1.4007118

The following have contributed to this page: Dr Jae B Kwak