Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

Jae B. Kwak, Soonwan Chung
  • Soldering and Surface Mount Technology, February 2015, Emerald
  • DOI: 10.1108/ssmt-03-2014-0008

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

The following have contributed to this page: Dr Jae B Kwak

In partnership with: