Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park
  • Microelectronics Reliability, July 2010, Elsevier
  • DOI: 10.1016/j.microrel.2010.04.003

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The following have contributed to this page: Dr Jae B Kwak