Deformation and Strain Measurement of Flip-Chip Solder Bump Under In-Situ Thermal Loading

Jae B. Kwak, Dong Gun Lee, Tung Nguyen, Seungbae Park
  • January 2009, ASME International
  • DOI: 10.1115/imece2009-12641

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http://dx.doi.org/10.1115/imece2009-12641

The following have contributed to this page: Dr Jae B Kwak