Experimental Assessment of Electronic Package Deformation Using Digital Image Correlation Technique

Jae B. Kwak, Soonwan Chung
  • Journal of The Japan Institute of Electronics Packaging, January 2011, Japan Institute of Electronics Packaging
  • DOI: 10.5104/jiep.14.422

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http://dx.doi.org/10.5104/jiep.14.422

The following have contributed to this page: Dr Jae B Kwak