Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

Satish C. Chaparala, Lawrence C. Hughes, Jae Kwak, Seungbae Park
  • January 2009, ASME International
  • DOI: 10.1115/interpack2009-89108

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http://dx.doi.org/10.1115/interpack2009-89108

The following have contributed to this page: Dr Jae B Kwak