Effect of shield-can for drop/shock behavior of board level assembly

Ji-Young Yoon, Kyung-Woon Jang, Jae Kwak, Da Yu, Seungbae Park, Soonwan Chung
  • June 2010, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/itherm.2010.5501286

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http://dx.doi.org/10.1109/itherm.2010.5501286

The following have contributed to this page: Dr Jae B Kwak