The effects of underfill on the thermal fatigue reliability of solder joints in newly developed flip chip on module

Jae B. Kwak, Soonwan Chung
  • May 2012, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/itherm.2012.6231487

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http://dx.doi.org/10.1109/itherm.2012.6231487

The following have contributed to this page: Dr Jae B Kwak