Integrated hygro-swelling and thermo-mechanical behavior of mold compound for MEMS package during reflow after moisture preconditioning

Jae B. Kwak, Seungbae Park
  • Microelectronics International, January 2015, Emerald
  • DOI: 10.1108/mi-04-2014-0014

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http://dx.doi.org/10.1108/mi-04-2014-0014

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