Effect of damping and air cushion on dynamic responses of PCB under product level free drop impact

Seungbae Park, Abdullah Al-Yafawi, Jae Kwak, John Lee, Da Yu
  • May 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/ectc.2009.5074172

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http://dx.doi.org/10.1109/ectc.2009.5074172

The following have contributed to this page: Dr Jae B Kwak