All Stories

  1. Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding

    Article • Science and Technology of Welding & Joining, February 2013, Taylor & Francis

    Dr Masakatsu Maeda

  2. Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding

    Article • MATERIALS TRANSACTIONS, January 2013, Japan Institute of Metals

    Dr Masakatsu Maeda

  3. Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding

    Article • Microelectronics Reliability, January 2011, Elsevier

    Dr Masakatsu Maeda

  4. Temperature Field in the Vicinity of FSW-Tool During Friction Stir Welding of Aluminium Alloys

    Article • Welding in the World, March 2005, Springer Science + Business Media

    Dr Masakatsu Maeda

  5. Interfacial Microstructure of Silicon Carbide and Titanium Aluminide Joints Produced by Solid-State Diffusion Bonding

    Article • MATERIALS TRANSACTIONS, January 2004, Japan Institute of Metals

    Dr Masakatsu Maeda

  6. Solid-state diffusion bonding of silicon nitride using titanium foils

    Article • Metallurgical and Materials Transactions A, August 2003, Springer Science + Business Media

    Dr Masakatsu Maeda

  7. Solid State Diffusion Bonding of Silicon Nitride Using Vanadium Foils

    Article • MATERIALS TRANSACTIONS, January 2003, Japan Institute of Metals

    Dr Masakatsu Maeda

  8. Implantation and Migration of Gold Atoms in Silicon Induced by MeV Electron Irradiation

    Article • Defect and Diffusion Forum, January 1993, Trans Tech Publications

    Dr Masakatsu Maeda