What is it about?
This paper explains the deformation behavior of aluminum bonding wire, of which diameter is 300 micrometer, during ultrasonic bonding of the wire to silicon.
Featured Image
Why is it important?
The deformation of the wire is correlated to the expansion of the bond area. To control the deformation is essential for guaranteeing the reliability of the bond.
Read the Original
This page is a summary of: Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding, MATERIALS TRANSACTIONS, January 2013, Japan Institute of Metals,
DOI: 10.2320/matertrans.md201210.
You can read the full text:
Contributors
The following have contributed to this page
