What is it about?
The paper reports a heavily mixed structure of copper and tin, formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding.
Featured Image
Why is it important?
The paper shows the deformation behavior of copper on both sides of weld during ultrasonic bonding.
Read the Original
This page is a summary of: Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding, Microelectronics Reliability, January 2011, Elsevier,
DOI: 10.1016/j.microrel.2010.05.009.
You can read the full text:
Contributors
The following have contributed to this page
