(001) silicon surfacial grain boundaries obtained by direct wafer bonding process: accurate control of the structure before bonding

K. Rousseau *, J. Eymery, F. Fournel, J.-P. Morniroli, J.-L. Rouvière
  • The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, July 2005, Taylor & Francis
  • DOI: 10.1080/14786430500070834

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http://dx.doi.org/10.1080/14786430500070834

The following have contributed to this page: Dr Joel Eymery