All Stories

  1. Low-Temperature Characterization of Sheet and Contact Resistance in 4H-SiC Test Structures from 300 K to 4 K
  2. Characterization of 4H-SiC Lateral MOSFETs up to 773 K
  3. Experimental Analysis of 4H-SiC CMOS NOT Logic Gate Down to 100K
  4. 4H-SiC Tunneling Light Emitter as a Light-Source for Quantum Applications
  5. Influence of Different Contact Lengths on the Correct Extraction of the Resistance Parameters of TLM Test Structures on 4H-SiC
  6. Scalable Fabrication and Electrical Characterization of Lateral Pin-Diodes on 4H-SiC A-Plane Wafers for Functionalization of Silicon Vacancies
  7. Towards a Fully Integrated 4H-SiC A-Plane Quantum-Chip – Transistors and Light Emitters
  8. Challenges in Measuring Thin SiO<sub>2</sub> Layers on 4H-SiC via Spectroscopic Ellipsometry
  9. Effects of 673K Temperature Anneal on a 4H-SiC CMOS NOT Logic Gate
  10. Evaluation of Oxide Processing Steps in SiC Technology Using Contactless Corona-Based CV Measurements
  11. The Tunneling Field-Effect Transistor as Novel Device Concept for High-Frequency Hard-Switching Power Electronics
  12. Minority Charge Carrier Lifetime for Evaluating 4H-SiC Epitaxial Growth by Microwave Detected Photoconductivity Decay
  13. A 4H-SiC CTAT Temperature Sensor Operating Between 14 and 481 K
  14. Analysis of the Body Effect in a 4H-SiC NMOSFET Temperature Sensor Between100 and 673 K
  15. Probing crystal axis orientation of birefringent materials via polarized microspectroscopy and anisotropic optical modeling
  16. Modeling the partially detected backside reflectance of transparent substrates in reflectance microspectroscopy
  17. Formation of Structured Low-Ohmic p-Type Contacts on Al-Implanted 4H-SiC by Laser Annealing
  18. Gate Oxide Performance and Reliability on SmartSiC™ Wafers and the Influence of RTA Processing on Gate Oxide Lifetime
  19. Analysis of a 4H-SiC Lateral PMOSFET Temperature Sensor Between 14 K–482 K
  20. Performance Investigation of 4H-SiC PIN Photodiodes With Dual Emitter Designs for Enhanced UV-C Detection
  21. Second-Order Effects on 4H-SiC Lateral MOSFETs Characteristics up to 773 K
  22. Uniformity and Repeatability of the Electrical Performance of 4H-SiC Lateral CMOS Devices and Circuits After Postprocessing Annealing
  23. Spectro‐Spatial Unmixing in Optical Microspectroscopy for Thickness Determination of Layered Materials
  24. A 4H-SiC NMOSFET-Based Temperature Sensor Operating Between 14K and 481 K
  25. Analysis and Design of an SiC CMOS Three-Channel DC-DC Synchronous Buck Converter for High-Temperature Applications
  26. Temperature Sensing Elements for Harsh Environments in a 4H-SiC CMOS Technology
  27. Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550 Degrees C
  28. Analytical Modelling of the Quasi-Static Operation of a Monolithically Integrated 4H-SiC Circuit Breaker Device
  29. Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications
  30. Empirical Model of Low-Ohmic Nickel-Based Contact Formation on N-Type 4H-SiC Depending on Thermal Budget
  31. Low-Ohmic Nickel Contacts on N-Type 4H-SiC by Surface Roughness Dependent Laser Annealing Energy Density Optimization
  32. Fast Estimation of the Lateral Fidelity of Ion Implantation in 4H-SiC through Calibration to JFET Transfer Characteristics in TCAD
  33. Improvement of Reflectance Spectroscopy for Oxide Layers on 4H-SiC
  34. Temperature Dependence of 4H-SiC Gate Oxide Breakdown and <i>C</i>-<i>V</i> Properties from Room Temperature to 500 °C
  35. A 4H-SiC CMOS SPICE Level 3 Model for Circuit Simulations
  36. Novel Rapid and Deposition-Free Strategy for FIB Cross-Section Preparation
  37. Anisotropic stress observation of 4H‐SiC trench metal‐oxide semiconductor field‐effect transistor test structures by scanning near‐field optical Raman microscope
  38. Investigation of CMOS Single Process Steps on 4H-SiC a-Plane Wafers for Quantum Applications
  39. A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C
  40. An analog to digital converter in a SiC CMOS technology for high-temperature applications
  41. SiC CMOS Gate Driver for High-Temperature Aerospace Applications
  42. Defects distribution and evolution in selected-area helium ion implanted 4H–SiC
  43. A 4H-SiC CMOS Oscillator-Based Temperature Sensor Operating from 298 K up to 573 K
  44. 4H-SiC PIN Photodiode for VUV Detection Using an Enhanced Emitter Doping Design
  45. Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications
  46. Stiffness influence on particle separation in polydimethylsiloxane-based deterministic lateral displacement devices
  47. Correlating Optical Microspectroscopy with 4×4 Transfer Matrix Modeling for Characterizing Birefringent Van der Waals Materials
  48. Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding
  49. A DC SPICE Level 3 Model for 4H-SiC lateral NMOSFET under strong inversion conditions
  50. Threshold Voltage Adjustment on 4H-SiC MOSFETs Using P-Doped Polysilicon as a Gate Material
  51. On the interpretation of confocal spectral depth profiling of color center and carrier concentration by photoluminescence and Raman of implanted 4H–SiC
  52. Unconventional conductivity increase in multilayer black phosphorus
  53. CMOS-compatible manufacturability of sub-15 nm Si/SiO2/Si nanopillars containing single Si nanodots for single electron transistor applications
  54. Increasing flow rates in polydimethylsiloxane-based deterministic lateral displacement devices for sub-micrometer particle separation
  55. CMOS compatible manufacturing of a hybrid SET-FET circuit
  56. A Study of High Resistivity Semi-Insulating 4H-SiC Epilayers Formed via the Implantation of Germanium and Vanadium
  57. Aluminum Activation in 4H-SiC Measured on Laterally Contacted MOS Capacitors with a Buried Current-Spreading Layer
  58. Via Size-Dependent Properties of TiAl Ohmic Contacts on 4H-SiC
  59. Mechanisms of Ohmic Contact Formation of Ti/Al-Based Metal Stacks on p-Doped 4H-SiC
  60. MD simulation of two-temperature model in ion irradiation of 3C-SiC: Effects of electronic and nuclear stopping coupling, ion energy and crystal orientation
  61. Molecular dynamics simulation of color centers in silicon carbide by helium and dual ion implantation and subsequent annealing
  62. Lifetime limiting defects in 4H-SiC epitaxial layers: The influence of substrate originated defects
  63. MD simulation study on defect evolution and doping efficiency of p-type doping of 3C-SiC by Al ion implantation with subsequent annealing
  64. Confocal photoluminescence characterization of silicon-vacancy color centers in 4H-SiC fabricated by a femtosecond laser
  65. Density functional theory calculation of the properties of carbon vacancy defects in silicon carbide
  66. Sub-20 nm multilayer nanopillar patterning for hybrid SET/CMOS integration
  67. Advancing the sensitivity of integrated epoxy-based Bragg grating refractometry by high-index nanolayers
  68. Photoluminescence and Raman Spectroscopy Study on Color Centers of Helium Ion-Implanted 4H–SiC
  69. Highly accurate determination of heterogeneously stacked Van-der-Waals materials by optical microspectroscopy
  70. Low-Resistance Ohmic Contact Formation by Laser Annealing of N-Implanted 4H-SiC
  71. Pre-Deposition Interfacial Oxidation and Post-Deposition Interface Nitridation of LPCVD TEOS Used as Gate Dielectric on 4H-SiC
  72. Influence of Shallow Pits and Device Design of 4H-SiC VDMOS Transistors on In-Line Defect Analysis by Photoluminescence and Differential Interference Contrast Mapping
  73. Depth Profiling of Ion-Implanted 4H–SiC Using Confocal Raman Spectroscopy
  74. Nanocutting mechanism of 6H-SiC investigated by scanning electron microscope online observation and stress-assisted and ion implant-assisted approaches
  75. Raman Characterization of Carrier Concentrations of Al-implanted 4H-SiC with Low Carrier Concentration by Photo-Generated Carrier Effect
  76. Deeper insight into lifetime-engineering in 4H-SiC by ion implantation
  77. Decoration of Al Implantation Profiles in 4H-SiC by Bevel Grinding and Dry Oxidation
  78. Determination of Compensation Ratios of Al-Implanted 4H-SiC by TCAD Modelling of TLM Measurements
  79. Raman Spectroscopy Characterization of Ion Implanted 4H-SiC
  80. Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy
  81. Laser Surface Microstructuring of a Bio-Resorbable Polymer to Anchor Stem Cells, Control Adipocyte Morphology, and Promote Osteogenesis
  82. Normalized differential conductance to study current conduction mechanisms in MOS structures
  83. On the Limits of Scalpel AFM for the 3D Electrical Characterization of Nanomaterials
  84. One-step nanoimprinted Bragg grating sensor based on hybrid polymers
  85. Dose Dependent Profile Deviation of Implanted Aluminum in 4H-SiC During High Temperature Annealing
  86. Impact of Al-Ion Implantation on the Formation of Deep Defects in n-Type 4H-SiC
  87. Investigation of Ga ion implantation-induced damage in single-crystal 6H-SiC
  88. Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining
  89. Influence and Mutual Interaction of Process Parameters on the Z1/2 Defect Concentration during Epitaxy of 4H-SiC
  90. Influence of Al Doping Concentration and Annealing Parameters on TiAl Based Ohmic Contacts on 4H-SiC
  91. Influence of Triangular Defects on the Electrical Characteristics of 4H-SiC Devices
  92. Flexible thin film bending sensor based on Bragg gratings in hybrid polymers
  93. Nano- and Micro-Patterned S-, H-, and X-PDMS for Cell-Based Applications: Comparison of Wettability, Roughness, and Cell-Derived Parameters
  94. Detailed characterisation of focused ion beam induced lateral damage on silicon carbide samples by electrical scanning probe microscopy and transmission electron microscopy
  95. Novel approach based on continuous trench modelling to predict focused ion beam prepared freeform surfaces
  96. TiO2 surface functionalization of COC based planar waveguide Bragg gratings for refractive index sensing
  97. Bulk lifetime characterization of corona charged silicon wafers with high resistivity by means of microwave detected photoconductivity
  98. Polymerization related deformations in multilayer soft stamps for nanoimprint
  99. Waveguide Bragg Gratings in Ormocer®s for Temperature Sensing
  100. 4.5 kV SiC Junction Barrier Schottky Diodes with Low Leakage Current and High Forward Current Density
  101. Point Contact Current Voltage Measurements of 4H-SiC Samples with Different Doping Profiles
  102. Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques
  103. Large area manufacturing of plasmonic colour filters using substrate conformal imprint lithography
  104. Fabrication of Bragg grating sensors in UV-NIL structured Ormocer waveguides
  105. Generalized approach to design multi-layer stacks for enhanced optical detectability of ultrathin layers
  106. Combination of direct laser writing and soft lithography molds for combined nano- and microfabrication
  107. Waveguide Bragg gratings in Ormocer hybrid polymers
  108. Modelling of Effective Minority Carrier Lifetime in 4H-SiC n-Type Epilayers
  109. Hybrid polymers processed by substrate conformal imprint lithography for the fabrication of planar Bragg gratings
  110. Comparison of silicon and 4H silicon carbide patterning using focused ion beams
  111. A DLTS study of hydrogen doped czochralski-grown silicon
  112. Metastable Defects in Proton Implanted and Annealed Silicon
  113. Comparative Spatially Resolved Characterization of a Czochralski-Grown Silicon Crystal by Different Laser-Based Imaging Techniques
  114. The Efficiency of Hydrogen-Doping as a Function of Implantation Temperature
  115. Junction formation and current transport mechanisms in hybrid n-Si/PEDOT:PSS solar cells
  116. Tailoring the Electrical Properties of HfO 2 MOS-Devices by Aluminum Doping
  117. Current conduction mechanism of MIS devices using multidimensional minimization system program
  118. Modelling of the electrochemical etch stop with high reverse bias across pn-junctions
  119. Optical polymers with tunable refractive index for nanoimprint technologies
  120. Inkjetable and photo-curable resists for large-area and high-throughput roll-to-roll nanoimprint lithography
  121. DLTS characterization of proton-implanted silicon under varying annealing conditions
  122. A New Method to Increase the Doping Efficiency of Proton Implantation in a High-Dose Regime
  123. Deep-Level Defects in High-Dose Proton Implanted and High-Temperature Annealed Silicon
  124. Bioactivation of Plane and Patterned PDMS Thin Films by Wettability Engineering
  125. MeV-proton channeling in crystalline silicon
  126. Enabling large area and high throughput roll-to-roll NIL by novel inkjetable and photo-curable NIL resists
  127. Nanoscale Characterization of TiO 2 Films Grown by Atomic Layer Deposition on RuO 2 Electrodes
  128. Thickness mapping of high-κ dielectrics at the nanoscale
  129. HCl Assisted Growth of Thick 4H-SiC Epilayers for Bipolar Devices
  130. Comparison of Carrier Lifetime Measurements and Mapping in 4H SiC Using Time Resolved Photoluminscence and μ-PCD
  131. Processing of silicon nanostructures by Ga+ resistless lithography and reactive ion etching
  132. Functional epoxy polymer for direct nano-imprinting of micro-optical elements
  133. Melt depth and time variations during pulsed laser thermal annealing with one and more pulses
  134. Bimodal CAFM TDDB distributions in polycrystalline HfO2 gate stacks: The role of the interfacial layer and grain boundaries
  135. Evaluation of resistless Ga + beam lithography for UV NIL stamp fabrication
  136. TiO2-Based Metal-Insulator-Metal Structures for Future DRAM Storage Capacitors
  137. Influence of parasitic capacitances on conductive AFM I-V measurements and approaches for its reduction
  138. Influence of Epilayer Thickness and Structural Defects on the Minority Carrier Lifetime in 4H-SiC
  139. Accuracy of wafer level alignment with substrate conformal imprint lithography
  140. Simple and efficient method to fabricate nano cone arrays by FIB milling demonstrated on planar substrates and on protruded structures
  141. Novel organic polymer for UV-enhanced substrate conformal imprint lithography
  142. Life time evaluation of PDMS stamps for UV-enhanced substrate conformal imprint lithography
  143. Characterization of grain boundaries in multicrystalline silicon with high lateral resolution using conductive atomic force microscopy
  144. All electrochemical layer deposition for crystalline silicon solar cell manufacturing: Experiments and interpretation
  145. Light confinement by structured metal tips for antenna-based scanning near-field optical microscopy
  146. A highly sensitive evaluation method for the determination of different current conduction mechanisms through dielectric layers
  147. Manufacturing, characterization, and application of nanoimprinted metallic probe demonstrators for electrical scanning probe microscopy
  148. Gate oxide reliability at the nanoscale evaluated by combining conductive atomic force microscopy and constant voltage stress
  149. Electrical Characterization of Nanostructured p-Silicon Electrodes for Bioimpedance Measurements on Single Cell Level
  150. Current Voltage Characteristics through Grains and Grain Boundaries of High-k Dielectric Thin Films Measured by Tunneling Atomic Force Microscopy
  151. Characterization of thickness variations of thin dielectric layers at the nanoscale using scanning capacitance microscopy
  152. Simulation of focused ion beam etching by coupling a topography simulator and a Monte-Carlo sputtering yield simulator
  153. Influence of FIB patterning strategies on the shape of 3D structures: Comparison of experiments with simulations
  154. Guided phase separation of polymer blend thin films on ion beam-induced pre-patterned substrates
  155. Full wafer microlens replication by UV imprint lithography
  156. Fabrication of metallic SPM tips by combining UV nanoimprint lithography and focused ion beam processing
  157. (Invited) Electrical Scanning Probe Microscopy Techniques for the Detailed Characterization of High-k Dielectric Layers
  158. Comprehensive study of focused ion beam induced lateral damage in silicon by scanning probe microscopy techniques
  159. Comparative study between conventional macroscopic IV techniques and advanced AFM based methods for electrical characterization of dielectrics at the nanoscale
  160. UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale
  161. Experimental observation of FIB induced lateral damage on silicon samples
  162. Correlation of microscopic and macroscopic electrical characteristics of high-k ZrSi[sub x]O[sub 2−x] thin films using tunneling atomic force microscopy
  163. Improved insight in charge trapping of high-k ZrO2/SiO2 stacks by use of tunneling atomic force microscopy
  164. Tunneling atomic-force microscopy as a highly sensitive mapping tool for the characterization of film morphology in thin high-k dielectrics
  165. Recent improvements in the integration of field emitters into scanning probe microscopy sensors
  166. Custom-specific UV nanoimprint templates and life-time of antisticking layers
  167. SSRM characterisation of FIB induced damage in silicon
  168. Detailed Carrier Lifetime Analysis of Iron-Contaminated Boron-Doped Silicon by Comparison of Simulation and Measurement
  169. Accurate parameter extraction for the simulation of direct structuring by ion beams
  170. Quantitative oxide charge determination by photocurrent analysis
  171. UV nanoimprint materials: Surface energies, residual layers, and imprint quality
  172. Detailed Photocurrent Analysis of Iron Contaminated Boron Doped Silicon by Comparison of Simulation and Measurement
  173. Characterization of interface state densitiesby photocurrent analysis: comparison of results for different insulator layers
  174. Some aspects of the high-temperature behavior of bismuth, strontium and barium on silicon surfaces studied by total reflection X-ray fluorescence spectrometry
  175. The influence of the measurement environment on the accuracy of the extraction of the physical parameters of solar cells