Reliability of power electronic packages: the importance of interconnection technologies

What is it about?

This chapter deals with the reliability of die interconnections used in plastic discrete power packages, dedicated to on-board electronic systems used in a wide range of applications such as automotive industry. A complete reliability analysis of 2 bonding technologies – aluminum wire and ribbon bonding – is proposed. This study is particularly focused on interconnection technologies’ aging, when the package is subjected to thermal cycling or power cycling with high temperature swings

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Why is it important?

Today’s industrial applications require higher current density in electronic power devices. These devices are implemented in more and more compact, lightweight, energy efficient, and cost-effective on-board systems. Die-interconnection technologies have a key role to play in achieving these objectives. They must above all warrant the electrical, thermal and mechanical stability of the whole package. Their process conditions must also be controlled, stable, reliable, and cost-effective. In this study, we have demonstrated that the ribbon bonding process has a higher robustness, which can be explained by the larger contact area on the chip, the low loop profile and the rigidity of the tape. The reliability of this type of interconnection is more than twice that of a wire bonding assembly

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