Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
Featured Image
Read the Original
This page is a summary of: High-Frequency Transmission Characteristics of the Interconnects Stacked into the 3D IC Configuration, Journal of The Japan Institute of Electronics Packaging, January 2011, Japan Institute of Electronics Packaging,
DOI: 10.5104/jiep.14.501.
You can read the full text:
Contributors
The following have contributed to this page
