Direct Wafer Bonding for Nanostructure Preparations

Hubert Moriceau, F. Rieutord, C. Morales, A.M. Charvet, O. Rayssac, B. Bataillou, F. Fournel, J. Eymery, A. Pascale, P. Gentile, A. Bavard, J. Mézière, Christophe Maleville, B. Aspar
  • Solid State Phenomena, January 2007, Trans Tech Publications
  • DOI: 10.4028/www.scientific.net/ssp.121-123.29

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http://dx.doi.org/10.4028/www.scientific.net/ssp.121-123.29

The following have contributed to this page: Dr Joel Eymery