Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

V. Verdingovas, M. S. Jellesen, R. Ambat
  • Corrosion Engineering Science and Technology, September 2013, Taylor & Francis
  • DOI: 10.1179/1743278213y.0000000078

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http://dx.doi.org/10.1179/1743278213y.0000000078

The following have contributed to this page: Vadimas Verdingovas