From silicon direct wafer bonding to surface nano-patterning: a way to innovative substrate elaboration

F. Fournel, A. Bavard, J. Eymery
  • October 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/soi.2009.5318788

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http://dx.doi.org/10.1109/soi.2009.5318788

The following have contributed to this page: Dr Joel Eymery