Effects of thermal cycling on the mechanical properties of gold wire bonding

  • Wan Yusmawati Wan Yusoff, Azman Jalar, Norinsan Kamil Othman, Irman Abdul Rahman
  • August 2014, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/smelec.2014.6920913

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http://dx.doi.org/10.1109/smelec.2014.6920913

The following have contributed to this page: Associate Prof. Dr Norinsan Kamil Othman