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This page is a summary of: Polycrystalline CPP-GMR devices using textured Co2Fe(Ga0.5Ge0.5) Heusler alloy layer and conductive Mg0.5Ti0.5Ox buffer layer, May 2015, Institute of Electrical & Electronics Engineers (IEEE), DOI: 10.1109/intmag.2015.7157286.
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