Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach

What is it about?

Poor stencil printing in electronics manufacturing causes faulty circuit boards. Our study introduces a new computer-based method to improve how solder paste is applied in SMT assembly, ensuring better quality for various board components. Tested in a Taiwanese factory, our method increased perfect boards from 99.35% to 99.5%, saving $3,750 monthly in repairs. This approach makes electronics more reliable and affordable, benefiting consumers and manufacturers by reducing waste and costs in circuit board production.

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