All Stories

  1. Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach

    Article • Soldering & Surface Mount Technology, July 2025, Emerald

    Dr. Tsung-Nan Tsai

  2. Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method

    Article • Applied Soft Computing, November 2016, Elsevier

    Dr. Tsung-Nan Tsai

  3. Toward decentralized intelligence in manufacturing: recent trends in automatic identification of things

    Article • The International Journal of Advanced Manufacturing Technology, March 2016, Springer Science + Business Media

    Dr. Tsung-Nan Tsai

  4. Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system

    Article • Journal of Intelligent & Fuzzy Systems Applications in Engineering and Technology, August 2015, IOS Press

    Dr. Tsung-Nan Tsai

  5. Capturing customer judgments of product category

    Article • Information Sciences, July 2014, Elsevier

    Dr. Tsung-Nan Tsai

  6. Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method

    Article • Microelectronics Reliability, January 2014, Elsevier

    Dr. Tsung-Nan Tsai

  7. Selection of the optimal configuration for a flexible surface mount assembly system based on the interrelationships among the flexibility elements

    Article • Computers & Industrial Engineering, January 2014, Elsevier

    Dr. Tsung-Nan Tsai

  8. An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly

    Article • International Journal of Computer Integrated Manufacturing, June 2013, Taylor & Francis

    Dr. Tsung-Nan Tsai

  9. A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly

    Article • Journal of Intelligent Manufacturing, August 2012, Springer Science + Business Media

    Dr. Tsung-Nan Tsai

  10. Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study

    Article • Applied Soft Computing, August 2012, Elsevier

    Dr. Tsung-Nan Tsai

  11. Development of a soldering quality classifier system using a hybrid data mining approach

    Article • Expert Systems with Applications, April 2012, Elsevier

    Dr. Tsung-Nan Tsai

  12. Improving the fine-pitch stencil printing capability using the Taguchi method and Taguchi fuzzy-based model

    Article • Robotics and Computer-Integrated Manufacturing, August 2011, Elsevier

    Dr. Tsung-Nan Tsai

  13. MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERATION: A COMPARATIVE STUDY

    Article • Journal of the Chinese Institute of Industrial Engineers, January 2009, Taylor & Francis

    Dr. Tsung-Nan Tsai

  14. Selection of the optimum promotion mix by integrating a fuzzy linguistic decision model with genetic algorithms

    Article • Information Sciences, January 2009, Elsevier

    Dr. Tsung-Nan Tsai

  15. Modeling and optimization of stencil printing operations: A comparison study

    Article • Computers & Industrial Engineering, April 2008, Elsevier

    Dr. Tsung-Nan Tsai

  16. A KNOWLEDGE-BASED SYSTEM FOR STENCIL PRINTING PROCESS PLANNING AND CONTROL

    Article • Journal of the Chinese Institute of Industrial Engineers, January 2007, Taylor & Francis

    Dr. Tsung-Nan Tsai

  17. Developing a multi-layer reference design retrieval technology for knowledge management in engineering design

    Article • Expert Systems with Applications, November 2005, Elsevier

    Dr. Tsung-Nan Tsai

  18. A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly

    Article • Engineering Applications of Artificial Intelligence, April 2005, Elsevier

    Dr. Tsung-Nan Tsai

  19. A neuro‐computing approach to the thermal profile control of the second‐side reflow process in surface mount assembly

    Article • Journal of Manufacturing Technology Management, April 2005, Emerald

    Dr. Tsung-Nan Tsai

  20. Neurofuzzy modelling of the reflow thermal profile for surface mount assembly

    Article • International Journal of Systems Science, February 2005, Taylor & Francis

    Dr. Tsung-Nan Tsai

  21. A neurofuzzy-based quality-control system for fine pitch stencil printing process in surface mount assembly

    Article • Journal of Intelligent Manufacturing, October 2004, Springer Science + Business Media

    Dr. Tsung-Nan Tsai

  22. Modeling and implementation of a neurofuzzy system for surface mount assembly defect prediction and control

    Article • IIE Transactions, July 2002, Taylor & Francis

    Dr. Tsung-Nan Tsai