What is it about?
This paper reveals the past histories on gold wire Bonding and its technical barriers and discusses on their future development of gold wire Bonding.
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Why is it important?
Holistic overview of Au wire Bonding and its technical barriers.
Perspectives
This article brings the key message of future technical insights of gold wire Bonding in semiconductor industry.
Dr Chong Leong Gan
Micron Technology Inc
Read the Original
This page is a summary of: Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review, Microelectronics International, April 2014, Emerald,
DOI: 10.1108/mi-07-2013-0036.
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