All Stories

  1. Innovations needed, reliability issues, and technical challenges in the development of electronic materials for future AI humanoid robots: a critical assessment

    Article • Journal of Materials Science Materials in Electronics, June 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  2. Electronic Materials Innovations and Reliability in Advanced Memory Packaging

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  3. Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  4. Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  5. Hardware Reliability for Module and Solid-State Drives (SSDs)

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  6. Influences of Electronic Materials Properties on Packaging Reliability

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  7. Materials Development for Future Datacenter Applications

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  8. Materials for Thermal Management in Advanced Memory Packaging

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  9. Substrate and Printed Circuits Board (PCB) for Memory Device Packaging

    Article • January 2025, Springer Science + Business Media

    Dr Chong Leong Gan

  10. Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review

    Article • Journal of Materials Science Materials in Electronics, October 2024, Springer Science + Business Media

    Dr Chong Leong Gan

  11. Interconnect Reliability in Advanced Memory Device Packaging

    Article • Journal of Adhesion Science and Technology, June 2024, Taylor & Francis

    Dr Chong Leong Gan

  12. A review on future novel interconnect and polymeric materials for cryogenic memory packaging

    Article • Journal of Materials Science Materials in Electronics, October 2023, Springer Science + Business Media

    Dr Chong Leong Gan

  13. Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

    Article • Journal of Materials Science Materials in Electronics, October 2023, Springer Science + Business Media

    Dr Chong Leong Gan

  14. Technological sustainable materials and enabling in semiconductor memory industry: A review

    Article • e-Prime - Advances in Electrical Engineering Electronics and Energy, September 2023, Elsevier

    Dr Chong Leong Gan

  15. Study of robust package strength characterization of memory packages for handheld application

    Article • Memories - Materials Devices Circuits and Systems, December 2022, Elsevier

    Dr Chong Leong Gan

  16. A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

    Article • Journal of Materials Science Materials in Electronics, October 2021, Springer Science + Business Media

    Dr Chong Leong Gan

  17. Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation

    Article • December 2020, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  18. Book Review: Assembly and reliability of lead-free solder joints. Springer. (2020)

    Article • Life Cycle Reliability and Safety Engineering, July 2020, Springer Science + Business Media

    Dr Chong Leong Gan

  19. Fan-Out Wafer-Level Packaging, Springer (2018), pp. 303

    Article • Life Cycle Reliability and Safety Engineering, June 2020, Springer Science + Business Media

    Dr Chong Leong Gan

  20. Reliability Physics and Engineering: Time-to-Failure Modeling, J. W. McPherson, Springer (2019). III, pp. 463

    Article • Life Cycle Reliability and Safety Engineering, January 2020, Springer Science + Business Media

    Dr Chong Leong Gan

  21. Book review

    Article • Microelectronics Reliability, July 2017, Elsevier

    Dr Chong Leong Gan

  22. Book review

    Article • Microelectronics Reliability, March 2017, Elsevier

    Dr Chong Leong Gan

  23. 3D Flash Memories

    Article • Microelectronics Reliability, October 2016, Elsevier

    Dr Chong Leong Gan

  24. Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

    Article • September 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  25. Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

    Article • September 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  26. Book Review

    Article • Microelectronics Reliability, August 2016, Elsevier

    Dr Chong Leong Gan

  27. Book Review

    Article • Microelectronics Reliability, April 2016, Elsevier

    Dr Chong Leong Gan

  28. Book review

    Article • Microelectronics Reliability, November 2015, Elsevier

    Dr Chong Leong Gan

  29. Reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds

    Article • October 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  30. Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

    Article • Microelectronics Reliability, July 2015, Elsevier

    Dr Chong Leong Gan

  31. Book review

    Article • Microelectronics Reliability, April 2015, Elsevier

    Dr Chong Leong Gan

  32. Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

    Article • Journal of Materials Science Materials in Electronics, March 2015, Springer Science + Business Media

    Dr Chong Leong Gan

  33. Influence of shear strength on long term biased humidity reliability of Cu ball bonds

    Article • Journal of Materials Science Materials in Electronics, August 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  34. Overview of gold wire Bonding in semiconductor industry.

    Article • Microelectronics International, April 2014, Emerald

    Dr Chong Leong Gan

  35. Evolution and investigation of copper and gold ball bonds in extended reliability stressing

    Article • Gold Bulletin, March 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  36. Book review

    Article • Microelectronics Reliability, February 2014, Elsevier

    Dr Chong Leong Gan

  37. Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

    Article • Journal of Electronic Materials, January 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  38. Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    Article • PLOS One, January 2014, PLOS

    Dr Chong Leong Gan

  39. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    Article • PLOS One, November 2013, PLOS

    Dr Chong Leong Gan

  40. Effects of wire type and mold compound on wearout reliability of semiconductor flash fineline BGA package

    Article • October 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  41. Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

    Article • Microelectronics International, July 2013, Emerald

    Dr Chong Leong Gan

  42. Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

    Article • Journal of Electronic Packaging, April 2013, ASME International

    Dr Chong Leong Gan

  43. Extended reliability of gold and copper ball bonds in microelectronic packaging

    Article • Gold Bulletin, April 2013, Springer Science + Business Media

    Dr Chong Leong Gan

  44. Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

    Article • Journal of Materials Science Materials in Electronics, March 2013, Springer Science + Business Media

    Dr Chong Leong Gan

  45. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

    Article • Journal of Nanomaterials, January 2013, Wiley

    Dr Chong Leong Gan

  46. Reliability challenges of Cu wire deployment in flash memory packaging

    Article • October 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  47. Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

    Article • October 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  48. Electronic Voting: A Review and Taxonomy

    Article • August 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  49. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

    Article • Journal of Nanomaterials, January 2012, Wiley

    Dr Chong Leong Gan

  50. Environmental friendly package development by using copper wirebonding

    Article • November 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan