What is it about?
Optimization Adhesion Strength of Copper Electroplating
Featured Image
Why is it important?
Enhance the Adhesion Strength of Copper Electroplating
Perspectives
Develop Copper Electroplating with high Adhesion Strength
Dr. Mahmood Hameed Mahmood
International Islamic University Malaysia
Read the Original
This page is a summary of: Modelling and Optimization of Copper Electroplating Adhesion Strength, IOP Conference Series Materials Science and Engineering, May 2017, Institute of Physics Publishing,
DOI: 10.1088/1757-899x/204/1/012017.
You can read the full text:
Contributors
The following have contributed to this page







