Groove topology for adesive joints

What is it about?

Many researchers have conducted studies on adhesively bonded joints experimentally and through simulation using finite elements. According to the study, the bonding strength can be enhanced by reducing the adhesive thickness and lengthening overlap. Introducing spews and their geometry could decrease the peeling stress at the end of the overlap area. Designing and optimizing the joint geometry is another effective way to increase the strength of bonded joints. In this research, a simulation is performed to investigate the effect of groove topology on the strength of the single lap joint. The adherend is given a groove in the direction of x (tensile axis), y, and xy. The tensile simulation was carried out to determine the effect of groove on peel stress and shear stress adhesive bonding which shown reduction in the overall peel stress and shear stress. Although xy groove configuration has the lowest peak peel stress, the overall peel stress is higher than the y groove configuration. X groove configuration suffers greatly from load eccentricity which increased the peak peel stress to the highest point among other configurations. Based on the results, the y groove configuration performs the best in reducing peel stress and shear stress compared to other configurations.

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Why is it important?

It is important to know the effect of the groove on the joint surface on the strength of the joint itself in FEM simulation.

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