What is it about?
This study investigated a surface modification and electroless copper (Cu) plating on the carbon fiber (CF) surface. Surface structure was studied and characterized at a different treatment temperature (150, 200 and 250) ºC for 1 hour. X-ray diffraction (XRD), Scanning Electron Microscopy (SEM), was used to analyze the coated samples. Three sharp diffraction peaks match with Bragg reflections (hkl planes) (111), (200), and (220) of (F.C.C.) structure of crystalline copper emerge around 2θ = 45.1o, 54.3 o and 76.2 o, respectively. The increase in the intensity peak and decrease the FWHM may be due to the increase in the average crystallite size of the treatment temperature increase. SEM image shows the changes from a tabular surface with a coarse surface after etching, sensitization and activation. It is also observed there is no deficiency on the Cu-coated carbon fiber this is due to uniformly deposit of Cu on the carbon fibers surface by using electroless plating. At a temperature of 150oC, an irregular surface morphology fully crowded with teeny grains and a few infrequent shaped cusp of the coatings. The coating surface morphology becomes more compact at the temperature reach to 250oC.
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Why is it important?
improve interfacial region between carbon fiber and epoxy
Perspectives
Writing this article was a great pleasure as it has co-authors with whom I have had long standing collaborations. This article also lead to rare disease groups contacting me and ultimately to a greater involvement in rare disease research.
Dr. Aseel Ameer Kareem
Iraq University College
Read the Original
This page is a summary of: Characteristics of electroless copper plating on modified carbon fiber, January 2020, American Institute of Physics,
DOI: 10.1063/5.0027392.
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