Coupling of the electrocaloric and electromechanical effects for solid-state refrigeration

What is it about?

Electronics devices generate excess heat and thus require thermal management. However, there are no suitable cooling techniques for electronics due to the rapid miniaturization in the recent years. Electrocaloric materials could be a solution to this problem. We have presented an idea how to combine electromechanical and electrocaloric properties of certain materials to design an efficient cooler for miniaturized electronics.

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Why is it important?

The presented device is efficient and scalable cooler which could be used for cooling of miniaturized electronics.