What is it about?

Three-dimensional (3D) plasma etching of materials by plasmas poses a significant challenge for microstructuring applications. We investigate the feasibility of using a metallic mask in combination with a magnetic field to tailor the plasma density and transport towards the substrate surface. Our experimental studies, complemented by particle-in-cell/Monte Carlo simulations, show that this approach allows for the creation of complex etch profiles with the potential to form complex 3D structures.

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Why is it important?

This proof-of-concept study is an important step in advancing our understanding of 3D etching techniques. By successfully demonstrating the efficacy of combining a magnetic field with a metal mask, we have established a solid foundation for further investigation. This innovative approach not only demonstrates the feasibility of intricate etching profiles, but also opens the door to unlocking the full potential of creating complex 3D structures. Our work paves the way for future research and applications in microstructuring, promising advances in fields such as sensors, optics, and microfluidics.

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This page is a summary of: Plasma sheath tailoring by a magnetic field for three-dimensional plasma etching, Applied Physics Letters, February 2024, American Institute of Physics,
DOI: 10.1063/5.0187685.
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