Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo-Quan Lu, Guang-Yin Lei
  • Journal of Electronic Materials, September 2007, Springer Science + Business Media
  • DOI: 10.1007/s11664-007-0230-5

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

http://dx.doi.org/10.1007/s11664-007-0230-5

The following have contributed to this page: Xu Chen

In partnership with: