All Stories

  1. Joining of TiAl Alloy Using Novel Ag–Cu Sputtered Coated Ti Brazing Filler
  2. Microstructural Characterization of Carbon Nanotubes (CNTs)-Reinforced Nickel Matrix Nanocomposites
  3. Microstructural Characterization of Aluminum-Carbon Nanotube Nanocomposites Produced Using Different Dispersion Methods
  4. TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers
  5. Reactive Commercial Ni/Al Nanolayers for Joining Lightweight Alloys
  6. Improved dispersion of carbon nanotubes in aluminum nanocomposites
  7. Reaction zone formed during diffusion bonding of TiNi to Ti6Al4V using Ni/Ti nanolayers
  8. Microstructure of Reaction Zone Formed During Diffusion Bonding of TiAl with Ni/Al Multilayer
  9. Diffusion bonding of TiAl using reactive Ni/Al nanolayers and Ti and Ni foils
  10. Anisothermal solid-state reactions of Ni/Al nanometric multilayers
  11. TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film
  12. Reaction-Assisted Diffusion Bonding of Advanced Materials
  13. In situTEM study of grain growth in nanocrystalline copper thin films
  14. Diffusion bonding of TiAl using Ni/Al multilayers
  15. Production of intermetallic compounds from Ti/Al and Ni/Al multilayer thin films—A comparative study
  16. Joining of TiAl alloys using Ni/Al multilayers
  17. Intermixing in Ni/Al multilayer thin films
  18. Joining of Superalloys to Intermetallics Using Nanolayers
  19. Joining of Superalloys to Intermetallics Using Nanolayers
  20. TEM and SEM in-situ annealing of nanocrystalline copper thin films
  21. Effect of Temperature in the Evolution of Ni/Al Nanolayers
  22. Effect of Annealing Conditions on the Grain Size of Nanocrystalline Copper Thin Films
  23. In-Situ TEM Annealing of Nanocrystalline Copper Thin Films
  24. Thermal Stability of Nanocrystalline Copper Thin Films