All Stories

  1. Leakage current conduction and reliability assessment of passivating thin silicon dioxide films onn-4H-SiC
  2. Simulation of temperature dependent dielectric breakdown in n+-polySi/SiO2/n-6H-SiC structures during Poole-Frenkel stress at positive gate bias
  3. Hole injection and dielectric breakdown in 6H–SiC and 4H–SiC metal–oxide–semiconductor structures during substrate electron injection via Fowler–Nordheim tunneling
  4. Effect of nitridation of hafnium silicate gate dielectric on positive bias temperature instability in pMOS devices
  5. A new degradation mechanism and its role on negative bias temperature instability in metal-oxide-semiconductor devices
  6. Positive bias temperature instability in p-type metal-oxide-semiconductor devices with HfSiON/SiO2 gate dielectrics
  7. Interface trap generation and recovery mechanisms during and after positive bias stress in metal-oxide-semiconductor structures
  8. Electron detrapping in thin hafnium silicate and nitrided hafnium silicate gate dielectric stacks
  9. Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO2 and HfO2/SiO2 gate dielectric stacks
  10. Mechanism of positive charge generation in the bulk of HfAlO/SiO2 stack
  11. Electrical stress-induced charge carrier generation/trapping related degradation of HfAlO/SiO2 and HfO2/SiO2 gate dielectric stacks
  12. Modeling of hole generation/trapping in ultrathin SiO{IN2} films during gate injection of electrons in direct tunneling regime
  13. Charge Trapping Related Degradation of Thin HfAlO∕SiO[sub 2] Gate Dielectric Stack during Constant-Voltage Stress
  14. Mechanisms for generation of oxide trapped charges in ultrathin silicon dioxide films during electrical stress
  15. Reliability analysis of thin HfO2/SiO2 gate dielectric stack
  16. On the electrical stress-induced oxide-trapped charges in thin HfO2∕SiO2 gate dielectric stack
  17. Charge carrier generation/trapping mechanisms in HfO2/SiO2 stack
  18. Direct tunneling stress-induced leakage current in ultrathin HfO2∕SiO2 gate dielectric stacks
  19. Experimental evidence of two conduction mechanisms for direct tunnelling stress-induced leakage current through ultrathin silicon dioxide gate dielectrics
  20. Effects of gate material on Fowler-Nordheim stress induced thin silicon dioxide degradation under negative gate bias
  21. Computationally efficient solution of carrier trapping/annihilation equation in MOS devices using Runge–Kutta method
  22. Gate polarity dependence of impact ionization probabilities in metal-oxide-silicon structures under Fowler–Nordheim stress
  23. Correlation between the gate bias dependence of the probability of anode hole injection and breakdown in thin silicon dioxide films
  24. Hole trapping due to anode hole injection in thin tunnel gate oxides in memory devices under Fowler–Nordheim stress
  25. Calculation of the probability of hole injection from polysilicon gate into silicon dioxide in MOS structures under high-field stress
  26. New positive charge trapping dynamics in SiO2 gate oxide, based on bulk impact ionization processes under Fowler–Nordheim stress
  27. Coupled charge trapping dynamics in thin SiO2 gate oxide under Fowler–Nordheim stress at low electron fluence
  28. A new approach to investigate gate oxide degradation of MOS capacitors during Fowler–Nordheim stress at low electron fluence
  29. Analysis of positive charge trapping in silicon dioxide of MOS capacitors during Fowler-Nordheim stress
  30. Hole trapping in thin gate oxides during Fowler - Nordheim constant current stress
  31. Positive charge trapping in thin gate oxides of MOS capacitors during constant current and voltage fowler-nordheim stress