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  1. Dynamic FSI simulation of pin transfer process for solder paste transport

    Article • January 2019, American Institute of Physics

    Zambri Samsudin

  2. Electrochemical Migration Behaviours of Low Silver Content Solder Alloy SAC 0307 on Printed Circuit Boards (PCBs) in NaCl Solution

    Article • Materials Science Forum, March 2016, Trans Tech Publications

    Associate Prof. Dr Norinsan Kamil Othman, Prof Azman Jalar, Zambri Samsudin