All Stories

  1. New registration calibration strategies for MBMW tools by PROVE measurements
  2. Multi-beam mask writer exposure optimization for EUV mask stacks
  3. MBMW exposure optimization for EUV mask stacks
  4. Mask process correction validation for multi-beam mask lithography
  5. Investigation of local registration performance of IMS Nanofabrication’s Multi-Beam Mask Writer
  6. Bulk micromachining of SiC substrate for MEMS sensor applications
  7. MEMS pressure sensor fabricated by advanced bulk micromachining techniques
  8. Laser ablation: A supporting technique to micromachining of SiC
  9. Micromachined membrane structures for pressure sensors based on AlGaN/GaN circular HEMT sensing device
  10. Optimization of illumination pupils and mask structures for proximity printing
  11. A suspended plate viscosity sensor featuring in-plane vibration and piezoresistive readout
  12. New progressive method suitable for the exposure optimization of large and complex defect-free chips direct written by ZBA 21 e-beam tool
  13. Investigation of high-resolution contact printing
  14. MAGIC: a European program to push the insertion of maskless lithography
  15. Fogging effect correction method in high-resolution electron beam lithography
  16. Exposure optimization in high-resolution e-beam lithography
  17. Mechanical characterization of membrane like microelectronic components
  18. Achieving CDU requirement for 90-nm technology node and beyond with advanced mask making process technology
  19. Fabrication of step and flash imprint lithography templates using a variable shaped-beam exposure tool
  20. Mask patterning process using the negative tone chemically amplified resist TOK OEBR-CAN024
  21. Shaped beam technology for nano-imprint mask lithography
  22. Nanostructuring of Mo/Si multilayers by means of reactive ion etching using a three-level mask
  23. Investigation of e-beam sensitive negative-tone chemically amplified resists for binary mask making
  24. Micromachined atomic force microscopy sensor with integrated piezoresistive sensor and thermal bimorph actuator for high-speed tapping-mode atomic force microscopy phase-imaging in higher eigenmodes
  25. Back to square 9: a demonstration of 9" reticle capability
  26. Tool and process optimization for 100-nm maskmaking using a 50-kV variable shaped e-beam system
  27. Gated field emitter arrays
  28. Evaluation and fabrication of AFM array for ESA-Midas/Rosetta space mission
  29. Coplanar and non-coplanar x-ray reflectivity characterization of lateral W/Si multilayer gratings
  30. Mechanical, geometrical, and electrical characterization of silicon membranes for open stencil masks
  31. Reactive ion etching with end point detection of microstructured Mo/Si multilayers by optical emission spectroscopy
  32. Aqueous base developable epoxy resist for high sensitivity electron beam lithography
  33. InGaP/GaAs/InGaP quantum wires grown on pre-patterned substrates by MOVPE
  34. Aqueous base development and acid diffusion length optimization in negative epoxy resist for electron beam lithography
  35. Field emission cathode array with self-aligned gate electrode fabricated by silicon micromachining
  36. Fabrication of open stencil masks with asymmetric void ratio for the ion projection lithography space charge experiment
  37. Progress on nanostructuring with Nanojet
  38. SEM and AFM characterisation of high-mesa patterned InP substrates prepared by wet etching
  39. Preparation of stair-step grooves by wet etching of AlAs/GaAs heterostructures and MOCVD growth of QWR
  40. A design and fabrication of a 3D force sensitive microprobe for surface characterization
  41. Resolution improvement of ion projector with a low energy spread multicusp ion source
  42. Structural characterization of a lamellar W/Si multilayer grating
  43. Structural characterization of lamellar multilayer gratings by x-ray reflectivity and scanning electron microscopy
  44. Directly sputtered stress-compensated carbon protective layer for silicon stencil masks
  45. Dry etching with gas chopping without rippled sidewalls
  46. Experimental results of the stochastic Coulomb interaction in ion projection lithography
  47. Minimum ion-beam exposure-dose determination for chemically amplified resist from printed dot matrices
  48. Fabrication of multipurpose piezoresistive Wheatstone bridge cantilevers with conductive microtips for electrostatic and scanning capacitance microscopy
  49. Micromachined ultrasharp silicon and diamond-coated silicon tip as a stable field-emission electron source and a scanning probe microscopy sensor with atomic sharpness
  50. p-n junction-based wafer flow process for stencil mask fabrication
  51. Comparative study of resist heating and proximity effect influence on CD variation in 30-kV EBL
  52. Electrical and detection properties of particle detectors based on LEC semi-insulating InP
  53. DUV resist UV II HS applied to high resolution electron beam lithography and to masked ion beam proximity and reduction printing
  54. Micro-technology of densely spaced non-conventional patterns for space applications
  55. Fabrication of multipurpose AFM/SCM/SEP microprobe with integrated piezoresistive deflection sensor and isolated conductive tip
  56. Preparation, characterisation and application of microscopic linear Hall probe arrays
  57. The integration of CMOS with plasma-enhanced micromachining
  58. Deep ultraviolet resists AZ DX-561 and AZ DX-1300P applied for electron beam and masked ion beam lithography
  59. Air Bridge Based Planar Hybrid Technology for Microwave and Millimeterwave Applications
  60. CD variation in 30-kV EBL due to resist heating: experiment and simulation
  61. Quantitative measurement of the resist heating in a variable shaped electron lithography
  62. Patterning of monolayers of crystalline S-layer proteins on a silicon surface by deep ultraviolet radiation
  63. Scanning probe sharp tip formation for IC integration using mesa technique
  64. The influence of polarization effects on an MSGC glass substrate
  65. <title>Chemically amplified deep UV resists for micromachining</title>
  66. <title>Fabrication of piezoresistive-sensed AFM cantilever probe with integrated tip</title>
  67. Evaluation of chemically amplified deep UV resis for micromachining using e-beam lithography and dry etching
  68. Silicon stencil masks for masked ion beam lithography proximity printing
  69. Bulk micromachining of Si by Lithography and Reactive Ion Etching (LIRIE)
  70. E-beam and RIE examination of chemically amplified positive-tone resist CAMP6
  71. On the application of chemically amplified positive resists to micromachining
  72. Quartz etching for phase shifting masks
  73. MEMS fabrication by Lithography and Reactive Ion Etching (LIRIE)
  74. Lithography and Reactive Ion Etching in Microfabrication
  75. Transfer of single-layer positive resist sub-micrometer and nanometer structures into silicon
  76. Submicro- and nanometer e-beam lithography and reactive ion etching with single layer chemically amplified negative resist
  77. Photoelectrical properties of GaAs MSM photodetector compatible with pseudomorphic heterostructure MESFET
  78. Single-layer resist for deep, micro- and nanometer structure transfer
  79. Newly developed novolak-based resist materials for ion projection lithography (IPL) with structure dimensions of 200-100 nanometers
  80. Experimental investigation of the resist heating effect in a variably shaped EBL system
  81. GaAs MSM Photodiode Using the Highly Doped Channel Layer of a Heterostructure MESFET
  82. Effect of Proton Bombardment on the Dark Current of GaAs MSM Structures
  83. Sub-0.25-μm ion projection lithography (IPL) in PMMA- and novolak-based resist materials (RAY-PF, RAY-PN, SAL-603)
  84. Process optimization and diffusion length evaluation of a new aqueous base developable negative epoxy electron beam resist
  85. Characterization of laterally nanopatterned W/Si multilayers
  86. 12 GHz coplanar quasi-monolithic oscillator
  87. Cathode sputtered permalloy films of high AMR effect and low coercivity
  88. GaAs FET characterization in a quasi-monolithic Si environment
  89. Novel plasma enhanced bulk micromachining process for MEMS
  90. T-shaped gate based on poly Si/polyimide supported layers