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  1. Reducing thermal mismatch stress in anodically bonded silicon–glass wafers: theoretical estimation
  2. Study of polycrystalline silicon obtained by aluminum-induced crystallization depending on process conditions
  3. Linear Thermal Expansion Coefficient (at Temperatures from 130 to 800 K) of Borosilicate Glasses Suitable for Silicon Compounds in Microelectronics
  4. Mechanical Stresses Estimation in Silicon and Glass Bonded at Elevated Temperature
  5. Model of Pressure Variation in a Vacuum System for Volatile Liquid Evacuation