All Stories

  1. MFIT : Multi-FIdelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

    Article • ACM Transactions on Design Automation of Electronic Systems, November 2025, ACM (Association for Computing Machinery)

    Harsh Sharma

  2. Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures Enabled by Non-Bendable Glass Interposer

    Article • ACM Transactions on Embedded Computing Systems, September 2025, ACM (Association for Computing Machinery)

    Harsh Sharma

  3. THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures

    Article • ACM Transactions on Embedded Computing Systems, August 2025, ACM (Association for Computing Machinery)

    Harsh Sharma

  4. A Heterogeneous Chiplet Architecture for Accelerating End-to-End Transformer Models

    Article • ACM Transactions on Design Automation of Electronic Systems, April 2025, ACM (Association for Computing Machinery)

    Harsh Sharma

  5. Florets for Chiplets for running Datacenter scale CNNs concurrently

    Article • ACM Transactions on Embedded Computing Systems, September 2023, ACM (Association for Computing Machinery)

    Harsh Sharma, Dr. Rasit O Topaloglu