All Stories

  1. Numerical modelling of penstock flow in dam

    Article • January 2023, American Institute of Physics

    Fei Chong Ng, Lariyah Sidek

  2. Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process

    Article • Soldering & Surface Mount Technology, October 2022, Emerald

    Fei Chong Ng

  3. Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process

    Article • Soldering & Surface Mount Technology, December 2021, Emerald

    Fei Chong Ng

  4. Surface energetic-based analytical filling time model for flip-chip underfill process

    Article • Soldering & Surface Mount Technology, May 2021, Emerald

    Fei Chong Ng

  5. Spatial analysis of underfill flow in flip-chip encapsulation

    Article • Soldering & Surface Mount Technology, September 2020, Emerald

    Fei Chong Ng