Finite Element Modeling of Copper Wire Bonding on a Stacked-Die in Semiconductor Devices

Xin Kai Tam, Pooria Pasbakhsh, N. Q. Guo, Norhazlina Ismail, Kheng Lim Goh
  • International Journal of Computer Theory and Engineering, January 2013, IACSIT Press
  • DOI: 10.7763/ijcte.2013.v5.824

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http://dx.doi.org/10.7763/ijcte.2013.v5.824

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