Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

  • Chun-Sean Lau, Mohd Zulkifly Abdullah
  • International Journal of Computer Theory and Engineering, January 2013, IACSIT Press
  • DOI: 10.7763/ijcte.2013.v5.767

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http://dx.doi.org/10.7763/ijcte.2013.v5.767