Erratum: “Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects”

  • Hideharu Shimizu, Kaoru Sakoda, Takeshi Momose, Yukihiro Shimogaki
  • Japanese Journal of Applied Physics, July 2014, Japan Society of Applied Physics
  • DOI: 10.7567/jjap.53.089202

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http://dx.doi.org/10.7567/jjap.53.089202