Finite Element Analysis of Copper Wire Bonding in Integrated Circuit Devices

Nauman Dastgir, Pooria Pasbakhsh, Ning Qun Guo, Norhazlina Ismail, Kheng Lim Goh
  • Advanced Materials Research, September 2012, Trans Tech Publications
  • DOI: 10.4028/www.scientific.net/amr.566.293

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

http://dx.doi.org/10.4028/www.scientific.net/amr.566.293

The following have contributed to this page: pooria pasbakhsh