Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
Featured Image
Read the Original
This page is a summary of: Pulsed Current Electrodeposition of Mn-Cu Alloys on SUS 430 Substrate as Coating Material for SOFC Interconnect Application, Advanced Materials Research, October 2015, Trans Tech Publications,
DOI: 10.4028/www.scientific.net/amr.1125.131.
You can read the full text:
Contributors
The following have contributed to this page